ams OSRAM Unveils Breakthrough Thin-Film VCSEL for AI Scale-Up, Showcasing Connectorized Multi-core Fiber Solution and Expanding Ecosystem Network

Moving data efficiently is becoming one of the defining challenges of next-generation AI systems. As AI clusters continue to scale, optical interconnects are emerging as critical technology for enabling higher bandwidth at significantly lower power consumption. Expanding ams OSRAM's Digital Photonics Interconnects platform into AI scale-up through a growing ecosystem of industry partners Introducing next-generation 850nm Thin-Film microVCSEL arrays with addressability enabling highly parallel "wide-and-slow" optical architectures Demonstrating error-free 32 Gb/s operation with approximately 0.25 pJ/bit energy efficiency and more than 2,000 hours reliability validation Showcasing a connectorized multi-core fiber solution with ecosystem partner BizLink PREMSTAETTEN, AUSTRIA and MUNICH, GERMANY - September 21, 2026 ( NEWMEDIAWIRE ) - ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing connectorized multi-core fiber solution and expanding ecosystem network. As artificial intelligence continues to drive unprecedented growth in computing infrastructure, moving data efficiently is becoming just as critical as processing it. The increasing scale of AI training and in